White Paper

Preparing for the Multiphysics Future of 3D ICs

3D ICs are transforming semiconductor design, but they bring complex multiphysics challenges—thermal effects, mechanical stress, and electrical integrity issues. Traditional 2D methodologies fall short. A shift-left approach to multiphysics verification is essential to detect issues early, ensuring high-yield, reliable designs.

Discover how Calibre’s advanced verification solutions help:

Optimize performance
Reduce costly rework
Accelerate time-to-market

Download the white paper to explore proven strategies for mastering 3D IC multiphysics analysis.

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